SVT group undertakes the research subjects of national 863 plan.

1. The name of the project: The construction of IC design industrialization base incubator.

The main research task:

a.  The construction of IC design platform of hardware and software;

b.  The study on the new methods of the construction, operation and management;

c.  Exploring the new guiding mode of national IC design enterprise incubator;

d.  Developing the supporting and operation mechanism of the IC design industrialization base.

2. The name of the project: The R&D of high-powered C*CORE and the developing platform of the applications.

The main research task:

The primary task of this subject is to design C*CORE (chip) with the dominium of the intellectual property on the base of taking in the core technology transferred MOTOROLA company. This subject contains the following jobs:

a.  The R&D on the C*CORE chip with intellectual property;

b.  The R&D on the applied chip based C*CORE;

c.  The R&D on the developing platform of the applied chip based C*CORE;

d.  The R&D system structure of high-powered C*CORE of the next generation which adopt the 32-bit Instruction with the compatibility of 16-bit Instruction, which enjoy the better performance and relatively high code density.

3. The name of the project: The research on IP standard

The main research task:

a.  Research on IP repetitiveness;

b.  Design of the bus on the standard chip;

c.  R&D and establishment of IP assessment platform and IP test platform;

d.  Cultivate the design talents;

The IP repetitiveness standard constituted in this project will play the guiding role in R&D of IP with intellectual property right of China and provide the reference to the national (departmental) standard.

4. The name of the project: The design of embedded high-speed and high-bit digital signal processor (DSP chip)

The research task:

The task of this project is to implement the R&D on the integrated DSP developing platform of with own intellectual property based the design of 32-bit DSP. The proposed platform includes the structure design of high-performance 32-bit DSP but also the development of embedded real-time operating system, the design of high-efficient compiler and R&D of the system-developing program. This project is to radically solve the problem that it is impossible to implement the industrialization after the success of R&D on DSP chip design technology.

5. The name of the project: The research on the high-pressure driving integration technology.

The main research task:

a.  Research on the structure of new power apparatus based on solid silicon standard low-voltage CMOS technique, constitute the relative model parameters;

b.  Research on the compatible power apparatus based solid silicon lower-voltage CMOS and new technique of circuit to overcome the existing autoecious effect to improve the working performance of the apparatus and circuit and to lower the production cost. Test the result through high voltage integrated chip design and flexible chip.

c.  Research on the structure and compatible techniques of new power apparatus based on extensional standard low-voltage CMOS technique, constitute the relative model parameters and the BCD technical parameter of formation of extensional material and test the result through high voltage integrated chip design and flexible chip.

d.  Research on the structure and compatible techniques of new power apparatus based on SOI material standard low-voltage CMOS technique and MEMS technique and constitute the relative model parameters through theoretical research, simulation and emulation.

6. The name of the project: The development of IP core of analogue/digital converter (ADC)

The main tasks of this subject is to design two models of high-speed and high-resolution analogue/digital converter as follows:

a.  Chip one: Self-design and R&D on the high-speed and high-resolution analogue/digital IP core. Test the performance through the design of high-speed and high-resolution analogue/digital converter chip and flexible chip. The sampling of speed is up to 40MSPS; the resolving rate is 10 10BIT.

b.  Chip two: Try to successfully develop advanced analog/digital converter chip (ADC) with high-speed (40MHz) and high-resolving power.

7. The name of the project: The SOC platform of High-Definition TV (HDTV)

The main tasks of this subject is to develop the SOC design technology of HDTV chip based on platform, which includes the tuner, channel receiving, decoding of signal, embedded microprocessor, audio/video, analog/digital and other types of outer interfaces. The proposed SOC design platform can be reconstructed and reconfigured according to different requirements. The SOC platform can also be used to implement the design of the HDTV receiver chips.

8. The name of the project: Digital Certificate SoC Chip

The main task of this project is to design and research on the network authentication system chips with own intellectual property, which are up PKI system (The chip family include encrypted smart digital certificate SoC chip and network electronic key digital certificate SoC chip). The proposed chip can create key pairs with high public key encryption/decoding operation speed quicker than 10 bps, which is capable to provide multi-certificate and multi-application service. The chip has the anti-attack ability of logical or physical attack and anti-converse-dissection capacity. The target market of the proposed chip is orientated to E-commerce, E-administration, informationization of enterprise and national military electronics etc.

9. The name of the project: The evaluating technology of IP CPU and IP CORE

The main task of this subject is to conduct the research on the testing method and evaluating technology of CPU and IP Core. The main aims of this subject are as follows:

a.  Solve the current key problem of evaluating technology of CPU and IP core;

b.  Establish the evaluating mechanism of homemade CPU and IP core preliminarily;

c.  Constitute the evaluating system and technical criterion of CPU and IP Core in China ;

d.  Make practical public technical proposals;

e.  Build the relatively effective evaluating environment;

f.  Implement evaluation of some proposed CPU and IP Core practically;

g.  Cultivate and educate a technical team that is familiar with the CPU and IP Core specialty.

10. The name of the project: High-voltage driving circuit module project

The main tasks of this project are aimed at the R&D of shading Plane Display of Plasma (PDP), including the following jobs:

a.  Design PDP series-addressing high-voltage driving chip based on solid silicon;

b.  Implement the development of PDP series driving circuit module;

c.  R&D of PDP high-voltage driving chip based on extended material;

d.  R&D of series driving circuit module and parallel driving chip applied to shading PDP.

11. The name of the project: Personal information processing terminal SoC

The main tasks of this project are oriented to personal information processing terminal SoC, including the following jobs:

a.  Build the developing environment of software and hardware based on the proposed SoC chip;

b.  Implement the R&D, popularization and industrialization of two prototypes of multi-media pocket PC based on the proposed Soc chip and industrial application system;